Success Story

Embedded Hardware Engineering

Hardware engineering encompasses not only board design, networking, testing and validation, and certification, but also the integration of various modules into efficient systems that allow seamless system/product interoperability.

We offer a quick and low-cost prototype for POC with accurate estimates on the EOL of the component as well. Partnerships help to get early access to a pre-launched solution from our supplier to deliver much faster time to market to our customers.


EE provide complete hardware design services developing consumer grade as well as mission critical electronic products and solution from component selection all the way to production support.

We help customers by adopting a systematic approach that transforms client\'s ideas and specifications into quality products which assure minimal schedule slippage, low product BOM, and engineering costs. Our specialization includes Board and System Design, Analog Mixed Signal/RF Design, FPGA Designs, ASIC/ System on Chip services.

Use case

A one stop shop mother board which can be stripped down for any embedded, industrial or commercial applications.

This is the latest embedded board which we have created right from selection of electronic components, schematic design, PCB design, PCB fabrication, hardware board bring up, BSP & OS bring up, application bring up by our team. It can run OS like Yocto Linux, Ubuntu IoT Core, Win10 IoT core etc. It can be customized to run any application in C++, Java or Web Applications with any sort of sensor application.


  • Hardware design services including architecture, schematics, layout, and Class A component selection for Industrial/Automotive/Commercial design
  • Building low power consumption and efficient battery managed devices
  • RF design: Multi-radios design, RF simulation, tuning, and antenna customization
  • Mechanical design/Enclosure designing for products
  • Designing IoT gateway, edge nodes, sensors, and hardware interfaces
  • Pre-compliance testing including vibration, thermal, EMI/EMC, interference and more
  • ROM estimation and BOM optimization
  • Region-specific certification such as FCC, CE, ROHS, UL, REACH, and more
  • Board Design: Multi-layer, HDI, Flex, Flex-Rigid for high-speed, battery operated, signal integrity and space-constrained designs

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